Design Skills

Over the past 5 years the company has recognised the need to invest in software predominantly to resolve engineering issues which are complex and which would involve substantive testing. This investment allows us to model and understand issues which have arisen with client designs. The analysis we can perform is as shown below and more details can be found in our consultancy section.

• 3D CAD system allowing importation of all major 3D file types
• Thermal 3D FEA software
• Motion 3D FEA software
• Stress/Strain 3D software
• Computational Fluid Dynamics software
• Mould Flow Analysis
• Static Magnetic Field Analysis
• Time Varient Magnetic Field Analysis

In addition to the above software related engineering skills we have extensive experience of mechanical construction and emphasise strongly the need for correct tolerancing of components for assembly and manufacture. Such skills are knowledge based and the company has a teaching program to pass these between engineers.

The company also has the capability to design circuit boards and simulate their performance. This is particularly useful in new applications where boards have not been made before or are being changed wholesale from the prototype issue.

In order to finalise the product design stage it is necessary to also look at the packaging design and the esthetic design of the sub-contract productivity. For both these processes Goudsmit uses outside contractors with whom a close working arrangement has been formed over several years. That said, budget packaging design can be done on our desktop publishing software and Goudsmit has photographic capabilities in house which allows it to generate high quality well lit digital images for instructions or packaging.